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Influence of cooling conditions on microstructure and mechanical property of Sn-0.3Ag-0.7Cu lead-free solder |
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| รหัสดีโอไอ | |
| Creator | Prajak JATTAKUL |
| Title | Influence of cooling conditions on microstructure and mechanical property of Sn-0.3Ag-0.7Cu lead-free solder |
| Contributor | Tavee MADSA, Piyawan SUNASUAN, Niwat MOOKAM |
| Publisher | Metallurgy and Materials Science Research Institute Chulalongkorn University |
| Publication Year | 2564 |
| Journal Title | Journal of Metals, Materials and Minerals |
| Journal Vol. | 31 |
| Journal No. | 2 |
| Page no. | 129-136 |
| Keyword | Sn-0.3Ag-0.7Cu solder, Cooling conditions, Microstructure, Mechanical propertyส |
| ISSN | 8576149 |
| Abstract | This research has investigated the influence of cooling conditions on the microstructure andสmechanical properties i.e., tensile strength and microhardness of Sn-0.3Ag-0.7Cu lead-free solder. In the experiments, casting was performed at 300_ with comparison between copper and stainless steel molds under slow and fast cooled conditions. X-ray diffractometer confirmed the presence ofสCu6Sn5สand Ag3Sn phases in the solder matrix. Lead-free solder solidified under slow cooled conditionsสexhibitedส-Sn matrix with larger grain growth as compared to the fast cooled solder. The eutectic areaสof intermetallic compound (IMC) was found to increase with cooling rate. The tensile strength of slow cooled solder was greater than fast cooled solder for both molds. In addition, the microhardness of the solder was also influenced by cooling rate. The dimples size of facture surface was decreased by higher cooling rate. A greater eutectic area of the Cu6Sn5สand Ag3Sn phases of initialส-Sn matrix lead to lower values of the mechanical property from fast cooled conditions. |
