Effect of Pulpal Pressure and Immediate or Delayed Dentin Sealing Techniqueon Microtensile Bond Strength of an Adhesive Resin Cement to Dentin: An In Vitro Study
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Creator Marisa Sukapattee
Title Effect of Pulpal Pressure and Immediate or Delayed Dentin Sealing Techniqueon Microtensile Bond Strength of an Adhesive Resin Cement to Dentin: An In Vitro Study
Contributor Teeranuch Rujirakanusorn, Sitthichai Wanachantararak, Aikaterini Kostagianni
Publisher Faculty of Dentistry, Chiang Mai University
Publication Year 2564
Journal Title Chiang Mai Dental Journal
Journal Vol. 42
Journal No. 2
Page no. 97-103
Keyword pulpal pressure, dental adhesives, immediate dentin sealing
URL Website http://www.dent.cmu.ac.th/cmdj/frontend/web/?r=site/index
Website title Chiang Mai Dental Journal
ISSN 2773-921X
Abstract Objectives: To evaluate the effect of pulpal pressure and immediate (IDS) or delayed dentin sealing (DDS) technique on microtensile bond strength (μTBS) of an adhesive resin cement to exposed human dentin.Methods: Fifty extracted human third molars were divided into 2 groups: pulpal and non-pulpal pressure (PP, NP), which represented vital and non-vital tooth. Each group was divided into 5 subgroups: direct restoration (control), DDS technique and 3 IDS techniques, [etch-and-rinse (TE), self-etching (SE) and universal adhesive (U)]. The hydrostatic pressure of 20 cmH2O was applied prior to adhesive application in PP groups during the experiment. The self-adhesive resin cement was used to bond a composite disc onto dentin for all groups. Ten small square beams from each group were fabricated and collected for μTBS testing and mode of failure monitoring.Results: All three IDS groups yielded a significantly higher μTBS than control and DDS groups in both pulpal conditions. DDS groups yielded the lowest μTBS. The presence of pulpal pressure caused a significant reductionof μTBS in TE and DDS groups.Conclusions: The IDS technique could produce higher μTBS than the DDS and direct restoration technique in both pulpal conditions.
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