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Effects of fouling formation in the cooling system of a central processing unit using Titanium Dioxide nanofluid |
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| รหัสดีโอไอ | |
| Creator | Kwanchai Nanan |
| Title | Effects of fouling formation in the cooling system of a central processing unit using Titanium Dioxide nanofluid |
| Contributor | Chayut Ployjirapas, Duangrudee Chutrakul |
| Publisher | Mahasarakham University |
| Publication Year | 2569 |
| Journal Title | Journal of Science and Technology Mahasarakham University |
| Journal Vol. | 45 |
| Journal No. | 2 |
| Page no. | 243-252 |
| Keyword | TiO2/water nanofluid, fouling, central processing units (CPU) |
| URL Website | https://li01.tci-thaijo.org/index.php/scimsujournal |
| Website title | Journal of Science and Technology Mahasarakham University |
| ISSN | 1686-9664 (Print), 2586-9795(Online) |
| Abstract | This research investigates the effects of fouling formation in the Cooling System of a CPU, divided into two main partsto enhance the cooling efficiency of central processing units (CPU). The first part focuses on identifying the optimalconcentration of TiO2/water nanofluids (0.02 Vol.%, 0.05 Vol.%, 0.1 Vol.%, and 0.15 Vol.%) for reducing CPUtemperatures compared to water-based cooling and heat sink systems. The results indicate that a 0.05 Vol.%concentration provides the best performance, reducing CPU temperatures by an average of 0.9 °C compared towater and 15.9 °C compared to heat sinks. In the second part, the optimal concentration (0.05 Vol.%) was tested over12 months to evaluate the effect of fouling on the system. The findings reveal that the cooling system maintains highefficiency during the first five months but starts to degrade thereafter. CPU temperatures increased by an average of1.1 °C due to fouling acting as a thermal insulator. This study highlights that TiO2/water nanofluids at a 0.05 Vol.%concentration can significantly enhance cooling performance, with fluid replacement recommended every five months to sustain efficiency. |
