Highly dense diamond particle-reinforced Ni-P coatings fabricated by pulse-stirring co-electrodeposition
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Creator 1. Nujira Kothanam
2. Komsak Harachai
3. Jiaqian Qin
4. Yuttanant Boonyongmaneerat
5. Napat Triroj
6. Papot Jaroenapibal
Title Highly dense diamond particle-reinforced Ni-P coatings fabricated by pulse-stirring co-electrodeposition
Publisher Faculty of Engineering, Khon Kaen University
Publication Year 2565
Journal Title Engineering and Applied Science Research
Journal Vol. 49
Journal No. 6
Page no. 797-803
Keyword Composite coating, Co-Electrodeposition, Friction coefficient, Wear resistance
URL Website https://ph01.tci-thaijo.org/index.php/easr/index
Website title Engineering and Applied Science Research
ISSN 2539-6161
Abstract Highly durable nickel-phosphorus/diamond (Ni-P/diamond) composite coatings were developed and successfully fabricated via co-electrodeposition. Large diamond particles, 20−30 μm, were co-electrodeposited into a Ni-P matrix. This work investigates the influence of bath stirring and current density on the diamond particle content in their deposits and tribological properties. The resulting coatings had uniformly distributed diamond particles in their deposits. Unlike the samples prepared using continuous stirring, those prepared by pulse-stirring appeared to have a much higher diamond particle concentration in the coatings. Energy dispersive X-ray spectroscopy (EDS) shows that diamond contents of up to 25.98 wt% can be achieved by pulse-stirring at a current density of 0.1 A/cm2. The friction coefficient was found to be relatively low and fluctuated in the range of 0.12 to 0.2. After subjecting specimens to a sliding wear test against a ZrO2 counter surface, no worn area was observed in the samples prepared using pulse-stirring at current densities of 0.05 A/cm2 and higher. This pulse-stirring fabrication technique allows the production of highly dense diamond particles incorporated into coatings with significantly enhanced wear resistance.
Engineering and Applied Science Research

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