<?xml version="1.0" encoding="UTF-8"?>
<xml><bibliography><APA>Uraiwan Pongsa และ Anongnat Somwangthanaroj. (2012) Effect of surface modification of multi-walled carbon nanotubes on thermal conductivity of underfill for microelectronic packaging. Chulalongkorn University:ม.ป.ท.</APA><Chicago>Uraiwan Pongsa และ Anongnat Somwangthanaroj. 2012. Effect of surface modification of multi-walled carbon nanotubes on thermal conductivity of underfill for microelectronic packaging. ม.ป.ท.:Chulalongkorn University;</Chicago><MLA>Uraiwan Pongsa และ Anongnat Somwangthanaroj.  Effect of surface modification of multi-walled carbon nanotubes on thermal conductivity of underfill for microelectronic packaging.  ม.ป.ท.:Chulalongkorn University, 2012. Print.</MLA></bibliography></xml>
