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<xml><bibliography><APA>Pitinan Piyavatin และผู้แต่งคนอื่นๆ. (2011) Effects of Ni, CO and In on microstructures, electrical properties and mechanical properties of Sn-Cu solder alloy. Chulalongkorn University:ม.ป.ท.</APA><Chicago>Pitinan Piyavatin และผู้แต่งคนอื่นๆ. 2011. Effects of Ni, CO and In on microstructures, electrical properties and mechanical properties of Sn-Cu solder alloy. ม.ป.ท.:Chulalongkorn University;</Chicago><MLA>Pitinan Piyavatin และผู้แต่งคนอื่นๆ.  Effects of Ni, CO and In on microstructures, electrical properties and mechanical properties of Sn-Cu solder alloy.  ม.ป.ท.:Chulalongkorn University, 2011. Print.</MLA></bibliography></xml>
